Beam Position Monitor (BPM) and sub-assemblies for ALS-U
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
Lawrence Berkeley National Laboratory (LBNL) is conducting market research to identify potential sources for Beam Position Monitor (BPM) major and sub-assemblies for the Advanced Light Source (ALS-U) project. This Request for Information (RFI) seeks to understand industry capabilities for this critical upgrade. Responses are due March 9, 2026, by 3:00 pm PT.
Purpose
LBNL is upgrading its Advanced Light Source (ALS) facility to significantly increase the brightness and coherent light fraction of soft x-rays. This RFI aims to identify vendors with the expertise, capabilities, and experience to supply the necessary BPM major and sub-assemblies. This is for informational and planning purposes only and is not a request for quote or proposal.
Scope of Interest
LBNL is seeking information on capabilities related to:
- PCB Design / Layout: High-speed digital, RF/analog, mixed signal, high-voltage, controlled impedance designs, CAD tools, DFM/DFT, and analysis (SI, PI, thermal).
- PCB Fabrication: Layer count, trace width/spacing, via size, controlled impedance tolerance, supported materials (e.g., FR-4, Rogers, polyimide), and lead times.
- PCB Assembly: SMT, through-hole, fine-pitch BGA, X-ray inspection, AOI, rework, conformal coating, functional testing, burn-in, cleanliness standards (IPC Class 2/3), lot traceability, and ESD controls.
- Testing & Quality: Details on testing capabilities and quality standards (e.g., ISO 9001, AS9100, IPC certifications).
- Chassis & Integration: Mechanical fabrication (sheet metal, CNC, powder coating), cable harness fabrication, rack integration, system-level wiring (including high-voltage), thermal management, and shock/vibration considerations.
- Programmatic & Capacity: Current production capacity, lead time drivers, and supply chain constraints.
- General: A summarized capability matrix and at least three similar project examples.
Submission Details
Responses must be emailed to Arielle Anoop (AAnoop@lbl.gov) no later than 3:00 pm PT on March 9, 2026. Submissions should include a list of previous projects and published product literature/technical specifications.
Eligibility & Notes
The primary NAICS Code for this effort is 334418 (Printed Circuit Assembly - Electronic Assembly Manufacturing), with a Small Business Size Standard of 750 employees. No specific set-aside is designated for this market research. This is a voluntary response; submission does not guarantee future consideration or award. Information provided may be publicly disclosed, so respondents should avoid including proprietary or confidential data.
Contact Information
Primary Contact: Arielle Anoop (aanoop@lbl.gov, 510-486-5519)