CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The National Institute of Standards and Technology (NIST), under the Department of Commerce, is seeking quotations for a CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for advanced packaged semiconductor devices and substrates. This acquisition is a Combined Synopsis/Solicitation (RFQ) for commercial products and services, aimed at supporting semiconductor manufacturing metrology research. The system will address critical metrology gaps for future microelectronics manufacturing and component integration. Quotations are due by February 26, 2026, at 11:00 AM Eastern Time.
Scope of Work
NIST requires an analytical instrument system capable of high-throughput, high-resolution, non-destructive three-dimensional (3D) X-ray imaging. Key requirements include:
- System Delivery: One X-ray Laminography/Tomography System (CLIN 0001) meeting detailed specifications in the Statement of Work.
- Performance: Must resolve 1 µm Metal/Non-metal line and space patterns at a scan speed of at least 0.5 mm³/min. X-ray Computed Laminography (XCL) mode is required, with X-ray Computed Tomography (XCT) mode being a value-add (higher resolution and faster speeds preferred).
- Components: X-ray source with suitable spot size, X-ray detector (min 13 megapixels), automated sample handling (up to 100x100x20mm), and manual loading for 300mm diameter samples.
- Software/Control: Robust instrument control, recipe saving, tiling, custom stage motion, remote access, and two reconstruction computers with specified software for data processing, reconstruction, and analysis.
- Services: Shipping, installation, and training (CLIN 0002), other transportation expenses (CLIN 0003), and optional service contracts for Years 2 through 5.
Contract Details
- Type: Request for Quotation (RFQ)
- Set-Aside: Full and Open Competition
- NAICS Code: 334413 - Semiconductor and Related Device Manufacturing (Size Standard: 1,250 employees)
- Place of Performance: Installation and training at NIST, Gaithersburg, MD.
- Delivery Timeline: System delivery within 32 weeks after award; installation and training within 2 weeks of delivery.
- Warranty: Minimum 1-year warranty, with optional service contracts for Years 2-5.
- Payment Schedule: 40% after acceptance of installation guidelines, 35% upon delivery, 25% upon government acceptance.
Submission & Evaluation
- Submission Deadline: February 26, 2026, 11:00 AM Eastern Time.
- Inquiries Deadline: 5 calendar days after solicitation issuance.
- Submission Method: Electronic quotations via email to tracy.retterer@nist.gov and Donald.collie@nist.gov. Reference RFQ number in the subject line.
- Quotation Structure: Must be clearly written, indexed, and logically assembled into four volumes: Technical, Demonstrated Experience, Price, and Terms/Conditions/Small Business Subcontracting Plan.
- Evaluation Criteria: Best value award, with non-price factors (Technical Capability and Prior Demonstrated Experience) being more important than price. The government may award without discussions.
- Eligibility: Offerors must have an ACTIVE SAM.gov registration. Small businesses must submit a subcontracting plan if not certified.
Key Provisions
Bidders must review Attachment 2 - Applicable Provisions and Clauses, which outlines the legal and contractual framework, including FAR and NIST-specific clauses, representations, and certifications (e.g., trade agreements, place of manufacture, security prohibitions).