CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The Department of Commerce's NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (NIST) has announced a contract award for a CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates. This award, published on April 15, 2026, supports laboratory equipment needs at Gaithersburg, MD. The awardee and contract value were not specified in this notice.
Scope of Work
This contract provides a specialized X-ray laminography/tomography system (Product Service Code 6640 - Laboratory Equipment And Supplies). The system is designed for high-throughput, high-resolution analysis of advanced packaged semiconductor devices and substrates, supporting critical research and development at NIST.
Contract & Timeline
- Type: Contract Award (specific type not provided)
- Award Date: April 15, 2026
- Set-Aside: None specified
- Place of Performance: Gaithersburg, MD, United States
Evaluation
The contract was awarded in accordance with the solicitation's evaluation criteria, selecting the proposed item that offered the best value to the Government.