Multiple Award PCB Fab and Assembly BPAs 2026-2030
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Re-solicitation of HQ072725QRT04
DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments.
DMEA intends to competitively issue six BPA agreements to offerors based on three factors in the Proposal Instructions and Evaluation Criteria. DMEA anticipate fulfilling orders of Sixty (60) GrimWing units and Sixty (60) DireWing units using the BPAs.
Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, and the proposal
instructions and evaluation criteria. Phase I proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 12:00pm (Pacific), Monday, 15 December 2025.