PACKAGING SUPPORT ENGINEER
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The National Aeronautics And Space Administration (NASA), specifically the NASA Shared Services Center, is soliciting quotes for a Packaging Support Engineer position. This requirement is a Total Small Business Set-Aside (FAR 19.5) and seeks support for design, flip-chip bonding, packaging, and analysis of test articles at Goddard Space Flight Center cleanrooms. The procurement is a Request for Quotation (RFQ) with a response deadline of January 23, 2026, at 3:00 p.m. CT.
Scope of Work
The selected contractor will provide junior-level engineering labor, supporting various projects including PRIMA, NGMSA, and "Demonstrating Large Low Noise Transition Edge Sensor Arrays for Future FIR Space Missions" (SAT).
Key tasks include:
- Performing adhesive bonding of flight-size microlens arrays with Kinetic Inductance Detector arrays for the PRIMA project, including release, cleaning, adhesive application, alignment (using SET FC300 bonder), and bond quality assessment.
- Establishing standard operating procedures for NGMSA indium bump bonding, pre-bonding inspection, cleaning, and performing indium bump bonding for micro-shutter arrays and fanout boards.
- Working with fabrication, packaging, and integration engineers for the SAT project, involving CAD design inspections, indium bump cleaning/inspection, flip-chip hybridization, and metrology.
- Developing proficiency in wire bonding, wafer dicing, and packaging assembly activities.
- Providing flip chip and die attach support, and training NASA GSFC personnel on flip chip bonding techniques and specialized equipment.
- Adhering to NASA GSFC documentation, work instructions, and lab protocols, and maintaining safety and equipment training.
Contract & Timeline
- Contract Type: Request for Quotation (RFQ)
- Product Service Code: R425 (Engineering And Technical Services)
- NAICS Code: 541715
- Set-Aside: Total Small Business Set-Aside (FAR 19.5)
- Period of Performance: 12 months ARO (After Receipt of Order), or specifically October 1, 2025, through December 31, 2026 (as per different SOWs, bidders should confirm).
- Place of Performance: Goddard Space Flight Center (specific buildings and labs listed in SOWs).
- Published Date: January 16, 2026
- Quote Due Date: January 23, 2026, at 3:00 p.m. CT
- Questions Due Date: January 22, 2026, at 3:00 p.m. CT (in writing via email)
Special Requirements & Submission
- Technical Proficiency: Experience with SET FC300/FC150 Flip Chip Bonders, epoxy/indium bump bonding, OntosTT Atmospheric Plasma System, various microscopes, Finetech die bonder, Zygo interferometer, FLIR camera, and AST Edge-Gap Inspection and Metrology Tool.
- Personnel: Must be trained in cleanroom protocols, hazardous waste management, and familiar with NASA GSFC equipment/processes to minimize training time.
- AI Verbiage: Contractors must disclose AI technology use and adhere to additional requirements for covered AI systems/services.
- Submission: Quotes must be emailed to Cody Guidry (cody.d.guidry@nasa.gov), include the company's Unique Entity Identifier (UEI) and CAGE code, and list two points of contact. Quotes must remain valid for 30 days.
- Registration: Offerors must be registered at www.sam.gov.
- Provisions: Offerors are required to complete and return provisions 52.204-24 and 52.204-26.
Evaluation Criteria
Award will be made to the responsible Offeror whose quote, conforming to the solicitation, is the Lowest Price Technically Acceptable (LPTA).