PCB board fabrication and assembly

SOL #: 80NSSC26934342QCombined Synopsis/SolicitationSole Source

Overview

Buyer

National Aeronautics And Space Administration
National Aeronautics And Space Administration
NASA SHARED SERVICES CENTER
STENNIS SPACE CENTER, MS, 39529, United States

Place of Performance

Place of performance not available

NAICS

Bare Printed Circuit Board Manufacturing (334412)

PSC

Miscellaneous Electrical And Electronic Components (5999)

Set Aside

No set aside specified

Timeline

1
Posted
Jun 2, 2026
2
Submission Deadline
Jun 4, 2026, 8:00 PM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

NASA/NSSC intends to issue a sole source contract to Cirexx International for FPGA board fabrication and assembly to support advanced embedded systems and avionics development at NASA/Ames Research Center (ARC). This notice serves as a market survey to determine if other qualified sources exist. Interested organizations must submit their capabilities by June 4, 2026.

Scope of Work

NASA Ames requires the fabrication and assembly of 150 custom FPGA interface PCBs. These boards are critical for compact embedded systems used in research and prototype development related to advanced aerospace electronics and embedded processing architectures. Key requirements include:

  • Support for Ethernet networking, USB boot/debug, Raspberry Pi integration, and precision power monitoring.
  • Features such as high-density FPGA interconnects, controlled-impedance differential routing, Ethernet magnetics, USB interfaces, precision power monitoring circuitry, and multiple embedded compute interfaces.

Performance Standards

  • PCB Fabrication: Controlled impedance differential pair routing (within .005 inches accuracy), high-density fine-pitch fabrication, signal integrity, and electrical continuity/shorts testing.
  • PCB Assembly: Assembly of all provided components (FPGA module connectors, Ethernet magnetics, USB, current sense, passives), inspection of fine-pitch solder joints, and manufacturing consistency.

Contract & Timeline

  • Type: Sole Source (intended) / Combined Synopsis/Solicitation (for market research)
  • NAICS Code: 513210 - Miscellaneous Electrical And Electronic Components
  • Set-Aside: None (Sole Source)
  • Response Due: June 4, 2026, by 3:00 p.m. Central Standard Time
  • Published: June 2, 2026
  • Place of Performance: NASA/Ames Research Center (ARC)

Evaluation

This is a notice of intent to award a sole source contract. Responses from interested organizations will be evaluated solely to determine if the procurement can be conducted on a competitive basis. A determination not to compete is at the Government's discretion.

Additional Notes

  • The procurement will utilize FAR Part 12 for Commercial Items or Services.
  • NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable.
  • Primary Point of Contact: Kacey Hickman, Procurement Specialist, at kacey.l.hickman@nasa.gov.

People

Points of Contact

kacey HickmanPRIMARY

Files

Files

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Versions

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Combined Synopsis/Solicitation
Posted: Jun 2, 2026
PCB board fabrication and assembly | GovScope