Purchase of silicon-based photonics integrated circuit (PICs) for laboratory testing for the AstroPIC project.

SOL #: 80NSSC26936131QCombined Synopsis/SolicitationSole Source

Overview

Buyer

National Aeronautics And Space Administration
National Aeronautics And Space Administration
NASA SHARED SERVICES CENTER
STENNIS SPACE CENTER, MS, 39529, United States

Place of Performance

Place of performance not available

NAICS

Semiconductor and Related Device Manufacturing (334413)

PSC

Combination And Miscellaneous Instruments (6695)

Set Aside

No set aside specified

Timeline

1
Posted
Jun 16, 2026
2
Submission Deadline
Jun 22, 2026, 8:00 PM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

The National Aeronautics and Space Administration (NASA), through its NASA Shared Services Center (NSSC), intends to issue a sole source contract to Applied Nanotools for the purchase of silicon-based photonics integrated circuits (PICs). These PICs are required for laboratory testing as part of the AstroPIC project at NASA Ames Research Center. Interested organizations may submit capabilities by June 22, 2026, to determine if a competitive procurement is feasible.

Scope of Work

This requirement is for the manufacture of 56 silicon-based PIC devices (dies) based on NASA's provided silicon photonic layout design files. The PICs are intended for high-contrast imaging demonstrations for coronagraphy and require specific input grating coupler designs for high-efficiency coupling. The fabrication process will utilize electron-beam write lithography with both full and partial etch capabilities. Key specifications include:

  • Material: Silicon-on-Insulator (SOI).
  • Etch Depths: Partial etch (70nm ±10nm) and Full etch (220nm).
  • Oxide Cladding: 2.2 ± 0.2 micron thickness.
  • Metallization: Tri-layer for thermal phase shifters and deep trench process.
  • Deep Trenches: > 250 microns for thermal isolation.

Contract & Timeline

  • Type: Combined Synopsis/Solicitation (with intent for sole source)
  • Set-Aside: None (intended sole source to Applied Nanotools)
  • NAICS Code: 334413 (Combination And Miscellaneous Instruments)
  • Response Due: June 22, 2026, by 3:00 PM Central Standard Time
  • Published: June 16, 2026
  • Period of Performance: Delivery approximately 16 weeks after receipt of order.
  • Place of Performance: Delivery to NASA Ames Research Center, Moffett Field, CA.

Evaluation

NASA/NSSC intends to award a sole source contract to Applied Nanotools under the authority of FAR 12.102(a), as they have been determined to be the sole provider. Responses from other interested organizations will be evaluated solely to determine if this procurement can be conducted on a competitive basis. A determination not to compete is at the government's discretion.

Additional Notes

Applied Nanotools is a registered entity on SAM.gov (ID#: J3Q3ARBLN3H3). The Center Ombudsman for this acquisition can be found at the provided NASA link. Oral communications are not acceptable in response to this notice.

Primary Point of Contact: Kacey Hickman (kacey.l.hickman@nasa.gov)

People

Points of Contact

kacey HickmanPRIMARY

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Combined Synopsis/Solicitation
Posted: Jun 16, 2026
Purchase of silicon-based photonics integrated circuit (PICs) for laboratory testing for the AstroPIC project. | GovScope