Rapid Assured Access (R2A)

Quick Summary

The Defense Microelectronics Activity (DMEA) is issuing a Sources Sought Notice for its Rapid Assured Access (R2A) program. This initiative seeks potential sources to provide rapid, long-term assured semiconductor foundry access for Department of War (DoW) programs and defense contractors. The purpose is to conduct market research, determine the appropriate acquisition method, and gather information on industry capabilities. Responses are due by April 3, 2026.

Purpose & Objectives

The R2A program aims to establish enterprise-wide contracts through the Trusted Access Program Office (TAPO) to ensure rapid access to microelectronics manufacturers and facilitate the onboarding of additional vendors to mitigate future technology gaps. Key objectives include:

• Rapidly deploying technology and modernizing systems to outpace adversaries.
• Increasing production capacity and delivering wartime surge capacity for critical capabilities.
• Reinventing the semiconductor acquisition system to prioritize speed, execution, and agility.

Scope of Interest

DMEA is interested in capabilities across the entire spectrum of wafer manufacturing and related services, including mask data prep, mask sourcing, wafer fabrication, packaging, assembly, and test. The scope covers both prototype development and production. A key objective is for awardees to provide foundry access to Defense contractors and program offices via this contract vehicle, leveraging pre-negotiated terms and conditions. DMEA/TAPO will administer the contract vehicle, not be the primary user.

Information Sought

Vendors are encouraged to submit a statement, not exceeding twenty (20) pages, in a question/answer format. Specific information requested includes:

• Company Information: Name, address, POC, CAGE, UEI, business size (NAICS 334413), and business development approach for DoW work.
• Process Technologies: Details on production-qualified technologies (e.g., lithographic generation, wafer sizes), ISO 9001:2015 accreditation, operating temperature ranges, domestic photomask sourcing capabilities, and availability of Process Development Kits (PDKs) and design IP.
• Ancillary Services: Capabilities in design, technology development, test, failure analysis, post-processing, and packaging support, including ownership of yield/workmanship issues.
• Multi-Project Wafer Runs: Availability and pricing methodology for MPW or shuttle runs.
• Production Management: Data management systems for R2A information and communication of schedule updates.
• Order Fulfillment: Provision of shipping and warranty services.
• Technology Discontinuance: Ability to provide 12 months' notice for production discontinuance.
• Security & Export Controls: Ability to provide Trusted product flow (up to SECRET) and ITAR compliance.
• Forecasting: Ability to forecast contract vehicle utilization and provide quarterly updates.

Contract & Timeline

• Type: Sources Sought / Market Research
• Set-Aside: None specified
• Response Due: April 3, 2026, 21:00 UTC
• Published: March 5, 2026, 16:52 UTC
• NAICS: 334413, Semiconductor and Related Device Manufacturing (Small Business Size Standard: 1250 employees)
• PSC: R425, Support- Professional: Engineering/Technical

Evaluation

Responses will assist the Government in determining the appropriate acquisition method, the number of potential IDIQ contracts, and refining contract requirements. This notice is for planning purposes only and does not constitute a solicitation.

Additional Notes

DMEA is interested in industry comments on the potential structure of this IDIQ and any missing scope related to Foundry manufacturing.