Request for Information for Silicon/Germanium Epitaxial Wafers
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The U.S. Department of Commerce, National Institute of Standards and Technology (NIST) is issuing a Request for Information (RFI) for Silicon/Germanium Epitaxial Wafers. This RFI is for market research purposes to determine industry availability, capability, and the practicability of firm-fixed pricing for these specialized wafers. Responses are due by April 3rd, 2026, at 1:00 PM EST.
Scope of Work
NIST's CHIPS Metrology program requires high-quality epitaxial film stacks on silicon wafers for its research. The anticipated contract will include base line items with full wafer specifications and optional line items where exact specifications for lot size, layer count, thicknesses, and composition/doping will be specified upon ordering. Configurable parameters include wafer composition (e.g., "Thin" doped Si on Si, "Thick" SiGe on buffered Si, isotopically enriched 28Si on Si), substrate resistivity, film stack, and lot size (minimum 10 units).
Specific requirements detailed in the attached document include:
- Base Items (CLIN 0001 & 0002): "Thin" Si and SiGe layers on Si, with specific substrate and film stack layer details (thickness, composition, dopant) for 15 wafers each.
- Option Items (CLIN 0003-0007): Various configurations of doped Si on Si, isotopically enriched 28Si on Si, and SiGe layers, allowing for configurable parameters at the time of order.
- General Requirements: Substrates are 100 mm prime double-side polished <100> Si wafers, 525 µm thick, SEMI standard flats. Film stacks must be coherent layers with specified dopants (B, N, Ph, As, Sb) and concentrations up to 5x10^20 cm^-3.
Contract & Timeline
- Type: Special Notice / Request for Information (RFI) – This is not a solicitation.
- Set-Aside: None specified.
- Response Due: April 3, 2026, 1:00 PM EST.
- Published: March 25, 2026.
- Deliverables: For base items, within 20 weeks of award; for option items, within 20 weeks of option modification. Delivery to NIST Gaithersburg.
Evaluation
Responses will be used for market research to help NIST determine the appropriate acquisition strategy and assess the feasibility of Firm-Fixed Pricing for all listed line items.
Additional Notes
This notice is strictly for information gathering and does not constitute a solicitation, obligation, or commitment by NIST. The CHIPS Metrology program aims to address critical metrology gaps in the US semiconductor manufacturing ecosystem.