Semiconductor Die Bonding and Vacuum Packaging System
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The Naval Research Laboratory (NRL) is conducting market research via a Sources Sought Notice (SSN) to identify potential sources for a Semiconductor Die Bonding and Vacuum Packaging System. This RFI aims to gauge industry interest and capabilities for a system designed for mounting and sealing experimental chips. Responses are due by July 1, 2026.
Purpose
This Sources Sought Notice (SSN) is for informational and planning purposes only, supporting market research and procurement planning by the Naval Research Laboratory (NRL). It is not a solicitation and does not guarantee a future contractual commitment. The objective is to identify interested parties capable of providing a Semiconductor Die Bonding and Vacuum Packaging System as outlined in the attached draft specifications.
Scope of Work
The requirement is for a comprehensive system, provided by a single vendor, comprising a Die Bonding System and a Vacuum Reflow Furnace. The system is intended for mounting and sealing experimental chips to chip carriers and multi-chip module assemblies at the Naval Research Laboratory, Washington DC 20375.
Key features of the Die Bonding System include:
- Automated die transfer (2x2 mm to 25x25 mm) to various substrates (e.g., leadless chip carriers, 200 mm silicon wafers).
- Placement accuracy of ≤ 5 micrometers and a rate of ≥ 200 placements/hour.
- Pick and place force range of 5-5000 grams with integrated calibration.
- Optical vision system with look-up and look-down cameras, and flip chip bonding capability.
- Automated epoxy resin delivery.
The Vacuum Reflow Furnace is required for hermetic sealing of chip carriers, featuring:
- Accommodation for sample mounting plates up to 4 x 5 inches.
- Computer/PLC control for vacuum, process gas, and temperature profiles.
- Operating temperature range from room temperature to 450°C (± 5°C accuracy).
- Vacuum capability of 100 milliTorr or less and process gas capability (argon, nitrogen, helium).
Submission Requirements
Interested parties must submit a Capability Statement, no more than 10 pages, referencing RFI N00173-26-RFI-KN02. The statement must include:
- Contact Information: Company name, address, Point of Contact, phone, email, Unique Entity ID, CAGE Code, PSC Code, and Business Size/Socioeconomic Categories.
- Technical Information: List of capabilities/resources relevant to the draft specifications and any questions/suggestions regarding the specifications. Responders must tabulate responses to all enumerated requirements in the draft specifications with "Meets requirement" or "Does not meet requirement."
- Commerciality: Confirmation of whether the proposed item is commercial, evidence of sales to the general public, and availability of authorized resellers if the manufacturer.
Responses should be emailed to the Contract Specialist, Kevin Nguyen (kevin.nguyen3.civ@us.navy.mil), and the Contracting Officer, Jamie Dixon (jamie.l.dixon8.civ@us.navy.mil).
Contract & Timeline
- Type: Sources Sought / Market Research
- Set-Aside: None specified
- Response Due: July 1, 2026, 4:00 PM ET
- Published: June 16, 2026
Additional Notes
This RFI is for planning purposes only; the Government assumes no financial responsibility for costs incurred by respondents. The attached specifications are draft and subject to modification.