Silicon and Silicon/Germanium Epitaxial Wafers

Questions & Answers / Clarifications

This document provides responses to vendor questions regarding a solicitation for specialized silicon and silicon-germanium (Si/SiGe) wafers.

• Substrate Provision: Vendors must source their own epi substrate wafers; they will not be provided by the government.
• Wafer Size: The delivered wafer size must be 100 mm; flexibility is not permitted.
• Polishing: Only double-side polished (DSP) wafers are acceptable; single-side polished (SSP) wafers are not sufficient.
• Doping: Specific doping concentrations and types (Boron, Phosphorus) are clarified for various CLINs (0001, 0002, 0003, 0004, 0005, 0006, 0007), with details on layer structure, dopant concentration ranges, and whether doping is per layer or for the entire wafer.
• CLIN 0003 Structure: Allows for "thin" doped Si on Si wafers with up to 5 layers of doped silicon, intended for reference materials in dopant quantification metrology (SIMS and APT). Examples of layer stacks are provided.
• CLIN 0004 Structure: Limited to a single doped layer, unlike CLIN 0003 which allows multiple dopants and concentrations.
• CLIN 0006 Structure: Can configure film stacks similar to CLIN 0001 and 0002, with a numerical limit of 50 layers (250 nm max thickness). Multiple Ge compositions are allowed per layer.
• CLIN 0007 Structure: Involves fully relaxed (cubic) SiGe grown on a virtual substrate on Si, with processing to form SiGe on insulator wafers. Specifications for dopant, concentration, Ge composition, and thickness are determined at the time of order.

These clarifications refine the technical specifications for the wafers, particularly concerning substrate sourcing, wafer dimensions, polishing, and the detailed composition and structure of Si/SiGe layers for various contract line items (CLINs). Vendors should carefully review these answers to ensure their proposals accurately meet the refined requirements.

Solicitation / RFP / RFQ

This solicitation is for commercial items, specifically silicon and silicon/germanium epitaxial wafers, to support the National Institute of Standards and Technology (NIST) CHIPS Metrology program. The program aims to advance metrology capabilities for the U.S. semiconductor manufacturing ecosystem by addressing critical metrology gaps. NIST requires high-quality epitaxial film stacks on silicon wafers.

• The procurement includes several line items for "Thin" and "Thick" wafers with specific silicon and silicon/germanium layer compositions, thicknesses, and dopant levels.

• Specific line items include:

  • LINE ITEM 0001: "Thin" Si and SiGe layers on Si - Spec 1 (Quantity: 15 wafers)
  • LINE ITEM 0002: "Thin" Si and SiGe layers on Si - Spec 2 (Quantity: 15 wafers)

• Optional line items (0003-0007) are also included for "Thin" doped Si on Si, "Thick" doped Si on Si, Isotopically enriched 28Si on Si, "Thin" Si and SiGe layers on Si, and "Thick" SiGe on buffered Si. These optional items have a minimum quantity of 10 wafers and specifications may be configured at the time of order.

• Secondary Ion Mass Spectroscopy (SIMS) and Spreading Resistance Profiling (SRP) data for each lot of wafers must be available.

• Delivery shall occur within 20 weeks of award.

• This is a Request for Quotations (RFQ).

• The contract will be a purchase order.

• The North American Industrial Classification System (NAICS) code is 334413 - Semiconductor and Related Device Manufacturing, with a small business size standard of 1250 employees.

• Option line items are valid for three years after acceptance of CLINs 0001 and 0002.

• Offer Due Date: May 12, 2026, 1:00 PM ET.

• Quotations must demonstrate the quoted product's ability to meet or exceed minimum specifications.

• Firm-fixed price quotations are required for all line items.

• A completed copy of all required solicitation provisions must be included.

• An active System for Award Management (SAM) registration is required for technical evaluation.

• The award will be made to the responsible quoter whose quotation is the lowest price, technically acceptable.

• Price will be evaluated for technical acceptability, and then for overall fair and reasonable price.

• This acquisition is a 100% set-aside for Small Business.

• The solicitation document and incorporated provisions and clauses are effective through Department of Commerce FAC Deviation effective April 3, 2026.

• The Government's terms and conditions will prevail in case of conflict with the contractor's terms and conditions.

• The point of contact for solicitation information is ERIK FRYCKLUND at EDF@MAIL.NIST.GOV.