Silicon and Silicon/Germanium Epitaxial Wafers

SOL #: 1333ND26QNB030152Solicitation

Overview

Buyer

Commerce
National Institute Of Standards And Technology
DEPT OF COMMERCE NIST
GAITHERSBURG, MD, 20899, United States

Place of Performance

Place of performance not available

NAICS

Semiconductor and Related Device Manufacturing (334413)

PSC

Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery (3670)

Set Aside

Total Small Business Set-Aside (FAR 19.5) (SBA)

Timeline

1
Posted
Apr 27, 2026
2
Submission Deadline
May 12, 2026, 5:00 PM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

The National Institute of Standards and Technology (NIST), under the Department of Commerce, has issued a Solicitation (RFQ) for Silicon and Silicon/Germanium Epitaxial Wafers. This procurement supports the NIST CHIPS Metrology program, aiming to advance metrology capabilities for the U.S. semiconductor manufacturing ecosystem. This is a Total Small Business Set-Aside. Quotations are due by May 12, 2026, at 1:00 PM ET.

Scope of Work

NIST requires high-quality epitaxial film stacks on silicon wafers. The procurement includes several line items for "Thin" and "Thick" wafers with specific silicon and silicon/germanium layer compositions, thicknesses, and dopant levels. Key requirements include:

  • LINE ITEM 0001: "Thin" Si and SiGe layers on Si - Spec 1 (Quantity: 15 wafers)
  • LINE ITEM 0002: "Thin" Si and SiGe layers on Si - Spec 2 (Quantity: 15 wafers)
  • Optional Line Items (0003-0007): For "Thin" doped Si on Si, "Thick" doped Si on Si, Isotopically enriched 28Si on Si, "Thin" Si and SiGe layers on Si, and "Thick" SiGe on buffered Si. These have a minimum quantity of 10 wafers and configurable specifications.
  • Data Requirements: Secondary Ion Mass Spectroscopy (SIMS) and Spreading Resistance Profiling (SRP) data must be available for each lot.
  • Delivery: Within 20 weeks of award.

Contract & Timeline

  • Contract Type: Request for Quotations (RFQ) leading to a purchase order.
  • NAICS Code: 334413 - Semiconductor and Related Device Manufacturing (Small Business Size Standard: 1250 employees).
  • Set-Aside: 100% Total Small Business.
  • Offer Due Date: May 12, 2026, 1:00 PM ET.
  • Published Date: April 27, 2026.
  • Option Validity: Optional line items are valid for three years after acceptance of CLINs 0001 and 0002.

Submission & Evaluation

  • Submission: Firm-fixed price quotations are required for all line items. Offerors must include a completed copy of all required solicitation provisions and demonstrate the product's ability to meet or exceed minimum specifications.
  • Eligibility: An active System for Award Management (SAM) registration is mandatory for technical evaluation.
  • Award Basis: Award will be made to the responsible quoter whose quotation is the lowest price, technically acceptable. Price will be evaluated for technical acceptability, then for overall fairness and reasonableness.

Additional Notes

  • The Government's terms and conditions will prevail in case of conflict with the contractor's terms.
  • Contact: Erik Frycklund at erik.frycklund@nist.gov.

People

Points of Contact

Erik FrycklundPRIMARY

Files

Files

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Versions

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Solicitation
Posted: Apr 27, 2026
Silicon and Silicon/Germanium Epitaxial Wafers | GovScope