474299 Sources Sought: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly

SOL #: 474299Sources Sought

Overview

Buyer

Energy
Energy, Department Of
BROOKHAVEN NATL LAB -DOE CONTRACTOR
Upton, NY, 11973, United States

Place of Performance

Upton, NY

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

PSC

Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery (3670)

Set Aside

No set aside specified

Timeline

1
Posted
Jan 7, 2026
2
Last Updated
Feb 12, 2026
3
Response Deadline
Jan 16, 2026, 7:00 PM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

Brookhaven Science Associates, LLC (BSA), operating Brookhaven National Laboratory (BNL) under the U.S. Department of Energy (DOE), is soliciting quotes for DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly Services. This Request for Quote (RFQ) 474299 seeks experienced vendors for labor-only assembly of complex, cryogenic-capable Printed Circuit Boards (PCBs). Quotes are due by February 23, 2026.

Scope of Work

The requirement involves PCB assembly services, with the vendor providing labor only; BNL will supply all PCBs and parts. The project is divided into two phases:

  • Phase 1 (Pre-production): Build and deliver 20 board assemblies within one month of award. This phase serves as a qualification step, requiring a certificate of quality compliance.
  • Optional Phase 2 (Production): If exercised, build and deliver 360 production board assemblies for FD-VD (Far Detector in Vertical Drift technology) in three monthly batches (approx. 120 pieces each) within three months after the option is exercised. All work is to be performed offsite by the vendor, who is also responsible for shipping.

Key Requirements & Qualifiers

Offerors must demonstrate:

  • A minimum of 20 years of experience in complex PCB assemblies.
  • Prior experience building cryogenic electronics assemblies of similar complexity (e.g., ~50 component types, ~1,500 components, IPC-A-610 Class II compliance, ESD sensitive handling, and evidence of boards used at <120 K).
  • Provision of references for at least 3 comparable jobs, detailing technical specifications and contact information.
  • A quality system certified to ISO 9001 and compliance with BNL-QA-101 (Supplier Quality Assurance Requirements).

Contract Details

  • Contract Type: Firm Fixed Price (FFP).
  • Period of Performance: Base period of 3 months for Phase 1, extending to a total of 6 months if the Phase 2 option is exercised.
  • Payment Terms: Net 30 for large businesses; Net 10 for small businesses.
  • Freight Terms: FOB Destination, Freight Prepaid. BNL is tax-exempt.
  • Labor Standards: Subject to U.S. Department of Labor Wage Determination No. 2015-4157 and Service Contract Labor Standards (SCLS).

Submission & Evaluation

  • Quote Submission: Complete quotations, including a signed Quotation Pricing Sheet (Enclosure C), must be emailed to sprice@bnl.gov with "RFQ Number 474299" in the subject line.
  • Quote Due Date & Time: February 23, 2026, by 22:00 UTC.
  • Questions Due Date: February 11, 2026 (new questions are no longer accepted).
  • Quote Validity: 90 days.
  • Evaluation: Award will be made to the responsive and responsible Offeror with the lowest total price meeting all technical requirements and RFQ Qualifiers.

Eligibility & Set-Aside

This procurement is conducted under full and open competition.

  • NAICS Code: 334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing (size standard 750 employees).
  • SAM Registration: Vendors must be registered in SAM.gov with a Unique Entity ID (UEI #). Foreign vendors are exempt from SAM registration but must complete AMS-Form-050 (Enclosure B).

Clarifications & Notes

An updated Questions and Answers document (published February 12, 2026) clarifies the use of leaded solder, confirms boards will not be panelized, and provides an updated Bill of Materials (BOM), Gerber files, and connector datasheet. BNL will perform first article testing on the Phase 1 boards. Required forms for successful Offerors include Vendor ACH Authorization, W-9 (domestic), or W-8 (foreign) forms.

People

Points of Contact

Shaylyn PricePRIMARY

Files

Files

No files attached to this opportunity

Versions

Version 3
Solicitation
Posted: Feb 12, 2026
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Version 2
Solicitation
Posted: Feb 2, 2026
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Version 1Viewing
Sources Sought
Posted: Jan 7, 2026