474299: DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly-Request for Quote (RFQ)

Statement of Work (SOW) / Performance Work Statement (PWS)

This Statement of Work outlines the requirements for Printed Circuit Board (PCB) assembly services.

• The vendor will perform PCB assembly services.

• The vendor is responsible for providing labor only; Brookhaven National Laboratory (BNL) will provide PCBs and parts.

• The vendor is responsible for shipping the assembled boards.

• The assembly job is divided into two phases:

  • Phase 1 (Pre-production): Build 20 pieces of pre-production board assemblies. This phase serves as a qualification step before Phase 2 can be awarded.
    • A quote for 20 pieces (Phase 1) and 360 pieces (Phase 2) must be provided.
    • Delivery of the 20 pieces must be within one month.
    • A certificate of quality compliance must be provided.
  • Optional Phase 2 (Production): Build 360 pieces of production board assemblies for FD-VD (Far Detector in Vertical Drift technology).
    • Vendor will build and send 360 pieces to the BSA Technical Representative within 3 months after the option is exercised via contract modification.
    • Vendor will deliver these production board assemblies in 3 batches, approximately 120 pieces per month.

• Delivery of 20 pieces of board assemblies in Phase 1 must be less than one month.

• Certificate of quality compliance must be provided for Phase 1.

• Production board assemblies for Phase 2 will be delivered in 3 batches, approximately 120 pieces per month.

• The job is to be performed offsite by the vendor.

• The period of performance for Phase 2 is within 3 months after option exercise.

• Only authorized Technical Representatives can approve jobs.

• Issues will be identified by the BNL Technical Representative.

• No after-hours or weekend calls are expected or authorized.

Form / Attachment / Pricing Sheet

This document is a fabrication drawing for a Printed Circuit Board (PCB) - DUNE CRU PATCH PANEL, identified as drawing number 10-1889-1, Revision B. It provides detailed specifications and requirements for the manufacturing of this PCB.

• Fabrication Notes: Includes specifications for trace line widths, material (FR4, GPY), copper weight, solder mask type and color, overall board thickness, and bare board electrical testing.
• Tolerances: Specifies tolerances for hole diameters, plating thickness, and overall board warp and twist.
• Layer Detail: Outlines a 4-layer PCB construction with specific details for copper weight and thickness for each layer (Top, Ground Plane, Ground Plane, Bottom).
• Controlled Impedance Requirements: Details requirements for differential pairs on layers 1 & 4, including finished conductor width and spacing to achieve 100 OHMS +/-10% differential impedance.
• Markings: Requires manufacturer's logo, date code, UL code, ET stamp, and a 6mm*6mm QR code with specific information.
• Table of Components: Lists various component sizes, quantities, plating, and tolerances.

This drawing is critical for any bidder intending to manufacture the specified PCB. It defines all physical, electrical, and material requirements, including critical tolerances and special markings. Bidders must ensure their manufacturing capabilities and processes align with these specifications to submit a compliant proposal.

Form / Attachment / Pricing Sheet

This document contains technical drawings and specifications for a "DUAL CBN CBO PATCH PANEL". It appears to be a component or part of a larger system being procured.

• The drawing displays a patch panel with multiple ports labeled P1A through P12A.
• It includes dimensions, mounting details, and port configurations.
• The document is identified as Revision B, dated December 01, 2025, with part number 10-1889-1.
• It is controlled by the U.S. Department of Commerce Export Administration Regulations (EAR99 Technology).

Bidders should review these specifications to understand the exact physical and technical requirements for the patch panel component. This information is crucial for ensuring that any proposed solution or component meets the government's precise needs and specifications.

Form / Attachment / Pricing Sheet

This document provides technical specifications and a diagram for the DUNE CRU PATCH PANEL, part number 10-1889-1, Revision B. It details the physical layout and component labeling of the assembly.

• Diagram illustrating the top view of the patch panel.
• Labels for twelve ports (P1 through P12) and associated internal components (e.g., R37, R47, R51).
• Part number: 10-1889-1
• Revision: B
• Date: December-07-2024
• Layer: 1 (TOP)
• Assembly: TOP
• Control Statement: "This information is controlled by the U.S. Department of Commerce Export Administration Regulations 15 CFR Parts 730-774 as EAR99 Technology."

This attachment provides critical design and manufacturing details for a specific hardware component. Bidders may need to use this information to understand the technical requirements for producing or supplying this patch panel, or to ensure compatibility with other system components if this is part of a larger procurement.

Form / Attachment / Pricing Sheet

This document outlines the qualification requirements for offerors seeking to bid on the DUNE FD-VD CRP Patch Panel IO-1889-1B PCB Assembly. It details the experience and capabilities necessary to manufacture assemblies that operate at cryogenic temperatures (77 K).

• Experience: Offerors must demonstrate a minimum of 20 years of experience in complex PCB assemblies.
• Cryogenic Assembly Experience: Offerors must have experience building cryogenic electronics assemblies with similar complexity, including:
  • Approximately 50 different component types (mix of surface mount and through-hole).
  • Approximately 1,500 components per assembly.
  • Compliance with IPC-A-610 class II.
  • Stringent handling procedures for ESD-sensitive components.
• Reference Requirements: If an offeror has relevant experience, they must provide references for at least 3 successfully fabricated jobs, detailing:
  • Board size
  • Number of different component types
  • Number of surface mount components
  • Number of through-hole components
  • Total components mounted on board
  • IPC-A-610 class II compliance certificate
  • ESD handling procedures
  • Evidence of boards used at cryogenic temperatures (< 120 K)
• Reference Contact Information: References must include organization name, contact person, phone number, and email address.

This document is critical for potential bidders to assess their eligibility and prepare their proposals. Failure to provide the requested information will result in a non-responsive offer. It highlights specific technical and experience qualifications required for this specialized assembly.