CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

SOL #: 1333ND26QNB030031Combined Synopsis/Solicitation

Overview

Buyer

Commerce
National Institute Of Standards And Technology
DEPT OF COMMERCE NIST
GAITHERSBURG, MD, 20899, United States

Place of Performance

Gaithersburg, MD

NAICS

Semiconductor and Related Device Manufacturing (334413)

PSC

Laboratory Equipment And Supplies (6640)

Set Aside

No set aside specified

Timeline

1
Posted
Feb 12, 2026
2
Last Updated
Feb 24, 2026
3
Submission Deadline
Mar 9, 2026, 3:00 PM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

The National Institute of Standards and Technology (NIST) is soliciting quotations for a High-Throughput High-Resolution X-ray Laminography/Tomography System for advanced packaged semiconductor devices and substrates. This system will support research in semiconductor manufacturing metrology. The acquisition is being conducted as a Combined Synopsis/Solicitation (RFQ) under full and open competition. Quotations are due by March 9, 2026, at 3:00 PM ET.

Scope of Work

NIST requires one analytical instrument system capable of non-destructive 3D X-ray imaging. Key requirements include:

  • Spatial Resolution: Minimum 1 µm Metal/Non-metal line and space patterns.
  • Scan Speed: At least 0.5 mm³/min.
  • Operating Modes: X-ray Computed Laminography (XCL) is required; X-ray Computed Tomography (XCT) is desired, with higher resolution and faster speeds preferred.
  • Detector: Minimum 13 megapixels.
  • Sample Handling: Automated loading for samples up to 100 mm × 100 mm × 20 mm, with manual loading for 300 mm diameter samples. The system must accommodate diverse sample geometries, including full wafers, coupons, and packaged devices.
  • Software: Robust instrument control, data processing, reconstruction (including various algorithms), and analysis (including deep learning segmentation and 3D visualization) with remote access capabilities.
  • Deliverables: The system, installation, training for up to 4 NIST staff, and a minimum 1-year warranty. Optional service contracts for Years 2-5 are also included.

Contract Details

  • Contract Type: Request for Quotation (RFQ).
  • Set-Aside: Full and Open Competition.
  • NAICS Code: 334413 - Semiconductor and Related Device Manufacturing (Small Business Size Standard: 1,250 employees).
  • Place of Performance: NIST, Gaithersburg, MD 20899.
  • Delivery: 32 weeks after award, with installation and training within 2 weeks of delivery.
  • Facility: The instrument footprint must not exceed 1.5 m × 2.5 m. No cleanroom is required; it will be installed in a general-purpose lab.

Submission & Evaluation

  • Submission Deadline: March 9, 2026, 3:00 PM ET.
  • Submission Method: Electronic quotations via email to tracy.retterer@nist.gov and Donald.collie@nist.gov. Reference the RFQ number in the subject line.
  • Inquiries: Questions must be submitted in writing to the Contract Specialist and Contracting Officer no later than 5 calendar days after solicitation issuance.
  • Quotation Preparation: Must be clearly written, indexed, and logically assembled into four volumes: Technical, Demonstrated Experience, Price, and Terms/Conditions/Small Business Subcontracting Plan.
  • Evaluation Criteria: Best value award, with non-price factors (Technical Capability and Prior Demonstrated Experience) being more important than price. The government may award without discussions.

Important Notes

Offerors must have an ACTIVE registration in SAM.gov at the time of quotation submission, award, performance, and final payment. All terms and conditions, including those in Attachment 2 (Applicable Provisions and Clauses), must be reviewed, and any exceptions stated in the quotation.

People

Points of Contact

Tracy RettererPRIMARY
Donald CollieSECONDARY

Files

Files

Download
Download
Download

Versions

Version 2Viewing
Combined Synopsis/Solicitation
Posted: Feb 24, 2026
Version 1
Combined Synopsis/Solicitation
Posted: Feb 12, 2026
View
CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates | GovScope