F-16 Electronic Component
SOL #: SPRHA4-26-R-0089Solicitation
Overview
Buyer
DEPT OF DEFENSE
Defense Logistics Agency
DLA AVIATION AT OGDEN, UT
HILL AIR FORCE BASE, UT, 84056-5820, United States
Place of Performance
Place of performance not available
NAICS
Bare Printed Circuit Board Manufacturing (334412)
PSC
Electrical And Electronic Assemblies; Boards, Cards, And Associated Hardware (5998)
Set Aside
No set aside specified
Original Source
Timeline
1
Posted
Dec 1, 2025
2
Last Updated
Mar 2, 2026
3
Submission Deadline
Feb 28, 2026, 6:59 AM
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The Department of Defense, Defense Logistics Agency (DLA) Aviation at Ogden, UT, has issued a Solicitation for the F-16 Electronic Component, specifically for the manufacturing of Bare Printed Circuit Boards and the UNIT ASSY-ADVANCED MISSILE REMOTE INTERFACE, SMS (NSN: 5998-01-322-7746WF). This acquisition is restricted to qualified sources: Elbit America (CAGE: OWEC9) and Lockheed Martin (CAGE: 81755). Offers are due by February 28, 2026.
Scope of Work
The requirement involves manufacturing eight each of NSN: 5998-01-322-7746. Key aspects include:
- Bare Printed Circuit Board Manufacturing and UNIT ASSY-ADVANCED MISSILE REMOTE INTERFACE, SMS.
- Adherence to MIL-STD-130 for marking, MIL-STD-129 and ASTM-D-3951 for packaging.
- Supply chain traceability and comprehensive Counterfeit Prevention Measures, including a mandatory Counterfeit Prevention Plan (CPP) per DI-MISC-81832, due NLT thirty (30) calendar days after contract award.
- Compliance with detailed Engineering Data Requirements (EDR), specifying materials (e.g., SAE AMS-QQ-A-250/4), soldering (MIL-STD-2000, J-STD-001, with continued use of leaded solders), and Unique Identification (UID) application.
- Preservation, packaging, and marking according to AFMC Form 158, various DoD Military Standards (e.g., MIL-STD-2073-1, MIL-STD-147, MIL-STD-648), ASTM International, and ANSI standards. This includes handling hazardous materials, electrostatic discharge (ESD) sensitive items, and compliance with International Standards for Phytosanitary Measures (ISPM 15).
Contract Details
- Contract Type: Firm Fixed Price.
- Period of Performance: Delivery for Item 0001 is by November 30, 2027.
- Quantity: Quantity Range Pricing is requested for 8 Circuit Card Assemblies, with ranges from 1-2 EA up to 16-20 EA.
- Set-Aside: Restricted to Elbit America and Lockheed Martin.
- Notes: Foreign Military Sales (FMS) customers are involved, potentially leading to volatile quantities. On-Time Delivery (OTD) Improvement Initiative requirements are in place. Early and partial deliveries are acceptable.
Submission & Evaluation
- Offers Due: February 28, 2026, 06:59 UTC.
- Offer Firm Period: Offers must be held firm for 120 calendar days.
- Evaluation Factors: Past Performance is the most important factor, followed by Cost or Price.
Contact Information
For inquiries, contact Kody Quayle at kody.quayle@us.af.mil.
People
Points of Contact
Kody QuaylePRIMARY