F-16 Electronic Component

SOL #: SPRHA4-26-R-0089Solicitation

Overview

Buyer

DEPT OF DEFENSE
Defense Logistics Agency
DLA AVIATION AT OGDEN, UT
HILL AIR FORCE BASE, UT, 84056-5820, United States

Place of Performance

Place of performance not available

NAICS

Bare Printed Circuit Board Manufacturing (334412)

PSC

Electrical And Electronic Assemblies; Boards, Cards, And Associated Hardware (5998)

Set Aside

No set aside specified

Timeline

1
Posted
Dec 1, 2025
2
Last Updated
Mar 2, 2026
3
Submission Deadline
Feb 28, 2026, 6:59 AM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

The Department of Defense, Defense Logistics Agency (DLA) Aviation at Ogden, UT, has issued a Solicitation for the F-16 Electronic Component, specifically for the manufacturing of Bare Printed Circuit Boards and the UNIT ASSY-ADVANCED MISSILE REMOTE INTERFACE, SMS (NSN: 5998-01-322-7746WF). This acquisition is restricted to qualified sources: Elbit America (CAGE: OWEC9) and Lockheed Martin (CAGE: 81755). Offers are due by February 28, 2026.

Scope of Work

The requirement involves manufacturing eight each of NSN: 5998-01-322-7746. Key aspects include:

  • Bare Printed Circuit Board Manufacturing and UNIT ASSY-ADVANCED MISSILE REMOTE INTERFACE, SMS.
  • Adherence to MIL-STD-130 for marking, MIL-STD-129 and ASTM-D-3951 for packaging.
  • Supply chain traceability and comprehensive Counterfeit Prevention Measures, including a mandatory Counterfeit Prevention Plan (CPP) per DI-MISC-81832, due NLT thirty (30) calendar days after contract award.
  • Compliance with detailed Engineering Data Requirements (EDR), specifying materials (e.g., SAE AMS-QQ-A-250/4), soldering (MIL-STD-2000, J-STD-001, with continued use of leaded solders), and Unique Identification (UID) application.
  • Preservation, packaging, and marking according to AFMC Form 158, various DoD Military Standards (e.g., MIL-STD-2073-1, MIL-STD-147, MIL-STD-648), ASTM International, and ANSI standards. This includes handling hazardous materials, electrostatic discharge (ESD) sensitive items, and compliance with International Standards for Phytosanitary Measures (ISPM 15).

Contract Details

  • Contract Type: Firm Fixed Price.
  • Period of Performance: Delivery for Item 0001 is by November 30, 2027.
  • Quantity: Quantity Range Pricing is requested for 8 Circuit Card Assemblies, with ranges from 1-2 EA up to 16-20 EA.
  • Set-Aside: Restricted to Elbit America and Lockheed Martin.
  • Notes: Foreign Military Sales (FMS) customers are involved, potentially leading to volatile quantities. On-Time Delivery (OTD) Improvement Initiative requirements are in place. Early and partial deliveries are acceptable.

Submission & Evaluation

  • Offers Due: February 28, 2026, 06:59 UTC.
  • Offer Firm Period: Offers must be held firm for 120 calendar days.
  • Evaluation Factors: Past Performance is the most important factor, followed by Cost or Price.

Contact Information

For inquiries, contact Kody Quayle at kody.quayle@us.af.mil.

People

Points of Contact

Kody QuaylePRIMARY

Files

Files

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Versions

Version 3
Solicitation
Posted: Mar 2, 2026
View
Version 2Viewing
Solicitation
Posted: Dec 11, 2025
Version 1
Solicitation
Posted: Dec 1, 2025
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F-16 Electronic Component | GovScope