Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO)
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals for the Photonic Integrated Circuit Architectures for Scalable System Objectives (PICASSO) program. This Solicitation (DARPA-PS-26-13) seeks revolutionary advances in very large-scale photonic circuits, focusing on circuit-level innovation to achieve significant system-level performance gains in latency, efficiency, and bandwidth. The program anticipates awarding Other Transaction for Prototype (OT-P) agreements with an estimated $35 million in funding. Proposals are due March 6, 2026.
Purpose & Scope
DARPA's Microsystems Technology Office (MTO) aims to develop scalable photonic circuits with predictable performance. The focus is on composing photonic circuits with exceptional performance using existing devices, rather than incremental improvements to individual components. Proposed research should investigate innovative approaches for processing and signal regeneration within photonic circuits, ensuring optical signal integrity and minimizing excess noise. The program is structured into Technical Area 1 (TA1) Fundamentals, with two phases (Signal Integrity and Generalizable Functions), while TA2 (Applications) will be solicited separately.
Contract Details & Funding
- Instrument Type: Other Transaction for Prototype (OT-P) agreements under 10 U.S.C. § 4022.
- Anticipated Funding: $35 million.
- Period of Performance Start: July 1, 2026.
- Cost Share: A 1/3 cost share is not required if there is significant participation from a non-traditional defense contractor or nonprofit research institution.
- Model Agreement: A model OT agreement (Attachment I) is provided for proposers to suggest edits, which will not be evaluated but should align with the technical approach.
Key Requirements & Deliverables
Proposals must address TA1 in its entirety. Key technical requirements include developing circuit-level strategies for signal integrity, noise minimization, and predictable mode control. Proposers are encouraged to utilize domestic photonic foundries and assembly/packaging services, though overseas fabs can be used on a limited, justified basis. Deliverables include preliminary models, design reviews (PDR, CDR), reference system designs, characterization reports, interface documentation, and final reports.
Eligibility & Set-Aside
This opportunity has no set-aside designation. Historically Black Colleges and Universities, Small Businesses, Small Disadvantaged Businesses, and Minority Institutions are encouraged to submit. Non-U.S. organizations/individuals cannot be lead proposers. FFRDCs, UARCs, and Government Entities are not eligible. Foreign nationals may participate in subcontractor efforts deemed fundamental research but cannot receive Controlled Unclassified Information (CUI) or attend program meetings unless they are U.S. Permanent Residents submitting specific forms.
Submission & Evaluation
Proposals require an abstract submission as a prerequisite. Evaluation criteria, in descending order of importance, are: Overall Scientific and Technical Merit, Potential Contribution and Relevance to the DARPA Mission, and Budget and Price. Full proposals must include a Technical and Management Proposal (Volume 1, max 10 pages written content, 20-slide oral presentation) and a Price Proposal (Volume 2, using Attachment E spreadsheet). Mandatory certifications (Attachment F) are required. Proposers must request CUI materials using Attachment K, certifying NIST SP 800-171 compliance for electronic access or affirming protection for physical copies. DARPA is interested in the extent to which AI tools are used in proposal preparation.
Important Dates & Contact
- Abstract Due Date: February 2, 2026
- Question Submittal Closed: February 20, 2026
- Deadline to Notify of Intent to Submit Proposal: February 20, 2026
- Proposal Due Date: March 6, 2026, at 1:00 PM ET
- Contact: PICASSO PS Coordinator at PICASSO@darpa.mil