Automatic Wire Bonder
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The National Institute of Standards and Technology (NIST), under the Department of Commerce, is soliciting quotations for an Automatic Wire Bonder. This acquisition is a Total Small Business Set-Aside and is crucial for the Nanoscale Device Characterization Division's Memory device characterization platform project in Gaithersburg, MD. Quotations are due by March 20, 2026, at 12:00 PM EST.
Purpose & Scope
NIST seeks to procure one (1) automatic wire bonder to support the Physical Measurement Laboratory's (PML), Nanoscale Device Characterization Division (NDCD), Alternative Computing Group (ACG) Memory device characterization platform project. This tool is essential for bonding highly dense, very fine wires for chips, enabling the assessment of emerging technologies in memory applications.
Key Requirements & Deliverables
The required automatic wire bonder must be fully automatable with manual sample loading, capable of bonding die sizes of 10 x 10 mm and accepting ceramic packages of 50 x 50 mm. It must be a ball-wedge type bonder, able to complete 256 consecutive bonds using Au wire (up to 8 mm length), and bond 50 x 50 µm pads with an 80 µm pitch. The system must accept wire sizes from 0.5 mil to 1 mil, include a microscope and LCD screen, and allow pausing for mid-bonding inspection. All items must be new.
- CLIN 0001: Automatic Wire Bonder (QTY 1)
- CLIN 0002: Transportation and other related expenses (NTE)
Contract Details
This will result in a Firm-Fixed-Price Purchase Order. The period of performance is 16 weeks. Delivery is F.O.B Destination to NIST, Gaithersburg, MD. The contractor is responsible for installation within 2 weeks of delivery, including uncrating, rigging, setup, demonstration, and trash removal. Training for up to two users must be completed within 2 weeks after installation. A minimum 1-year warranty is required. Invoices must be submitted electronically to INVOICE@NIST.GOV and payment requests via the U.S. Department of the Treasury's IPP System. Cybersecurity requirements and compliance with NIST safety/security regulations for personnel are mandatory.
Submission & Evaluation
Quotations must be submitted electronically to elizabeth.timberlake@nist.gov and tracy.retterer@nist.gov by March 20, 2026, at 12:00 PM EST. The RFQ number must be referenced in the subject line. Submissions require three volumes:
- Volume I – Technical Quotation: Demonstrate capability, cite SOW paragraphs, include manufacturer authorization if applicable.
- Volume II – Price Quotation: Firm-fixed-price, include all shipping costs, valid for 90 days.
- Volume III – Terms and Conditions: Complete required information from attachments. Award will be made to the responsible offeror proposing the Lowest Price Technically Acceptable (LPTA) solution that meets all technical specifications. The government may award without discussions. Written inquiries must be submitted no later than 2 business days after solicitation issuance.
Eligibility & Set-Aside
This is a Total Small Business Set-Aside. Offerors must have an ACTIVE registration in SAM.gov at the time of quotation submission, award, performance, and final payment. The NAICS Code is 333242 - Semiconductor Machinery Manufacturing, with a size standard of 1,500 employees.
Additional Notes
The solicitation incorporates various FAR and CAR provisions and clauses by reference. Contractors must monitor NIST campus operating status daily for access.