Amendment 1 to Automatic Wire Bonder
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
The National Institute of Standards and Technology (NIST), Department of Commerce, has issued Amendment 1 to Solicitation 1333ND26QNB030043 for the procurement of an Automatic Wire Bonder. This amendment addresses vendor questions, clarifying technical requirements for the bonder. This is a Total Small Business Set-Aside. Quotations are due by March 20, 2026, 12:00 PM EST.
Purpose & Scope
NIST's Physical Measurement Laboratory (PML), Nanoscale Device Characterization Division (NDCD), Alternative Computing Group (ACG) seeks to acquire one (1) automatic wire bonder. The bonder will support the memory device characterization platform project, enabling the bonding of highly dense, very fine wires for chips and assessing emerging memory technologies. The amendment clarifies that samples (chips) need to be wire bonded to a 256-pin ceramic package, affixed to the bonder's stage, and the application involves bonding a 1 cm2 chip inside a 256-pin double-tiered ceramic package to streamline the process.
Key Requirements
The automatic wire bonder must be:
- Fully automatable with manual sample loading.
- Capable of bonding die sizes up to 10 x 10 mm and accepting ceramic packages up to 50 x 50 mm.
- A ball-wedge type bonder.
- Able to complete 256 consecutive bonds using Au wire (0.5 mil to 1 mil), with wire lengths up to 8 mm.
- Capable of bonding 50 x 50 um pads with an 80 um pitch.
- Equipped with a microscope and LCD screen, and the ability to pause bonding for inspection.
- The tool must contain a scope for inspection and a way to fix the sample piece to the stage.
- All items must be new; no used, remanufactured, experimental, prototype, or custom items.
- Compliance with NIST cybersecurity and safety regulations is required.
Contract Details & Timeline
- Contract Type: Firm-fixed-price purchase order.
- Set-Aside: Total Small Business Set-Aside (FAR 19.5).
- NAICS: 333242 - Semiconductor Machinery Manufacturing (Size Standard: 1,500 employees).
- Period of Performance: 16 weeks.
- Place of Performance: NIST, Gaithersburg, MD.
- Deliverables: Automatic Wire Bonder (CLIN 0001) and associated transportation (CLIN 0002).
- Installation & Training: Contractor to install within 2 weeks of delivery and provide training for up to 2 users within 2 weeks after installation.
- Warranty: Minimum 1 year.
Submission & Evaluation
- Quotations Due: March 20, 2026, 12:00 PM EST.
- Submission Method: Electronic via email to elizabeth.timberlake@nist.gov and tracy.retterer@nist.gov.
- Quotation Structure: Must include Technical, Price, and Terms and Conditions volumes.
- Evaluation: Lowest Price, Technically Acceptable (LPTA). Award may be made without discussions.
- SAM.gov: Active registration required.
Contact Information
- Primary: Elizabeth Timberlake (elizabeth.timberlake@nist.gov)
- Secondary: Tracy Retterer (Tracy.retterer@nist.gov)