PCB (Printed Circuit Board) Assembly Service
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
Brookhaven National Laboratory (BNL), on behalf of the U.S. Department of Energy, is soliciting quotes for offsite Printed Circuit Board (PCB) assembly services. This opportunity, a Combined Synopsis/Solicitation (RFQ), seeks a qualified vendor to provide labor-only services, with BNL supplying all PCBs and components. The effort includes a mandatory Phase 1 qualification build of 30 pre-production assemblies, followed by two optional production phases for 520 and 800 units, respectively, intended for DUNE FD-VD and FD-HD detectors. Quotes are due by Friday, February 20, 2026, at 11:59 PM ET.
Scope of Work
The selected vendor will provide PCB assembly services for electronics operating at cryogenic temperatures (77 K). BNL will furnish all necessary PCBs and components, while the contractor will be responsible for the assembly labor, packaging, and shipping of completed units.
- Phase 1 (Required): Build 30 pre-production board assemblies as a qualification step, to be delivered within one month of contract award, accompanied by a certificate of quality compliance.
- Optional Phase 2: Build 520 production board assemblies for the Far Detector in Vertical Drift Technology (FD-VD).
- Optional Phase 3: Build 800 production board assemblies for the Far Detector in Horizontal Drift Technology (FD-HD), anticipated Fall 2026.
Key Requirements
Offerors must demonstrate:
- A minimum of 20 years of experience in complex PCB assemblies.
- Experience building cryogenic electronics assemblies of similar complexity, including approximately 50 component types, a mix of surface mount and through-hole technologies, around 1,500 components, compliance with IPC-A-610 Class II, and stringent ESD handling procedures.
- References for at least three successfully fabricated jobs with comparable complexity, detailing board size, component types and counts, IPC-A-610 Class II compliance, ESD handling, and evidence of use at cryogenic temperatures.
Contract Details
- Contract Type: Firm-Fixed Price (FFP).
- Period of Performance: From contract award through September 30, 2026, with a 12-month option period exercisable in one-month increments, potentially extending to September 30, 2027. Phase 1 delivery is required one month after award.
- Set-Aside: Full and Open Competition.
- NAICS Code: 334418 (Printed Circuit Assembly), with a size standard of 750 employees.
- Place of Performance: Offsite (vendor's facility), with the contracting office in Upton, NY.
- Freight Terms: FOB Destination, Freight Prepaid.
Submission & Evaluation
- Questions Due: Friday, February 13, 2026, 11:59 PM ET.
- Quote Due: Friday, February 20, 2026, 11:59 PM ET.
- Submission Method: Email submissions only. Quotes must include the signed Quotation Pricing Sheet (Enclosure C) and the Offeror's SAM UEI Number. The email subject line must contain RFQ Number 471674.
- Evaluation Criteria: Award will be made to the responsive and responsible Offeror submitting the lowest total price that meets all technical requirements and RFQ qualifiers.
- Eligibility: Offerors must be registered in SAM.gov. Required Representations and Certifications (AMS-Form-050, Enclosure B) must be submitted if not active in SAM.gov.
Attachments
Key enclosures include the Draft Purchase Order/Contract (A), Annual Representations and Certifications (B), Quotation Pricing Sheet (C), Vendor ACH Authorization Form (D), W-9 Form (E), and W-8 Form (F, for foreign vendors).