PCB (Printed Circuit Board) Assembly Service
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
Brookhaven National Laboratory (BNL), a U.S. Department of Energy contractor, is soliciting quotes for offsite Printed Circuit Board (PCB) Assembly Services. This opportunity is for a qualified vendor to provide labor-only assembly, with BNL supplying all PCBs and components. The effort includes a mandatory Phase 1 qualification build of 30 pre-production assemblies, followed by two optional production phases for 520 and 800 units respectively. Quotes are due by Friday, February 20, 2026, at 11:59 PM ET.
Scope of Work
The selected vendor will provide PCB assembly services for electronics operating at cryogenic temperatures (77 K) for DUNE FD-VD and FD-HD detectors. BNL will supply all PCBs and components, while the vendor is responsible for assembly, packaging, and shipping completed units, adhering to proposed lead times.
- Phase 1 (Qualification): Assembly of 30 pre-production units, to be delivered within one month of contract award, accompanied by a certificate of quality compliance.
- Phase 2 (Optional): Assembly of 520 production units for the Far Detector in Vertical Drift Technology (FD-VD).
- Phase 3 (Optional): Assembly of 800 production units for the Far Detector in Horizontal Drift Technology (FD-HD), anticipated Fall 2026.
- BNL will perform first article testing of the populated PCBs; this is not a supplier responsibility.
Key Requirements
Offerors must demonstrate:
- Experience building cryogenic electronics assemblies of similar complexity (approx. 50 component types, SMT/through-hole mix, ~1,500 components).
- Compliance with IPC-A-610 Class II and stringent ESD handling procedures.
- A minimum of 20 years of experience in complex PCB assemblies.
- References for at least 3 successfully fabricated jobs with comparable complexity, including evidence of use at cryogenic temperatures.
Contract & Timeline
- Contract Type: Firm-Fixed Price (FFP)
- Period of Performance: Effective upon execution through September 30, 2026, with 12 additional option months, potentially extending to September 30, 2027. Phase 1 delivery is one month after award.
- Set-Aside: Full and Open Competition
- NAICS Code: 334418 (Printed Circuit Assembly), Size Standard: 750 employees
- Questions Due: Friday, February 13, 2026, 11:59 PM ET
- Quote Due: Friday, February 20, 2026, 11:59 PM ET
- Anticipated Freight Terms: FOB Destination, Freight Prepaid.
Submission & Evaluation
Quotes must be submitted via email and include the signed Quotation Pricing Sheet (Enclosure C) and SAM UEI Number. Award will be made to the responsive and responsible Offeror submitting the lowest total price that meets all technical requirements and RFQ qualifiers. Offerors must be registered in SAM.gov and complete AMS-Form-050 (Enclosure B) for representations and certifications.
Additional Notes
Required enclosures include a Draft Contract (A), Reps and Certs (B), Quotation Pricing Sheet (C), Vendor ACH Authorization (D), W-9 (E), and W-8 for foreign vendors (F). A Bill of Materials (BOM) is provided for component details.