PCB (Printed Circuit Board) Assembly Service

SOL #: 471674Combined Synopsis/Solicitation

Overview

Buyer

Energy
Energy, Department Of
BROOKHAVEN NATL LAB -DOE CONTRACTOR
Upton, NY, 11973, United States

Place of Performance

Upton, NY

NAICS

Printed Circuit Assembly (Electronic Assembly) Manufacturing (334418)

PSC

Electrical And Electronic Assemblies; Boards, Cards, And Associated Hardware (5998)

Set Aside

No set aside specified

Timeline

1
Posted
Feb 5, 2026
2
Last Updated
Feb 20, 2026
3
Submission Deadline
Feb 21, 2026, 4:59 AM

Qualification Details

Fit reasons
  • NAICS alignment with historical contract wins in similar service areas.
  • Scope strongly matches core technical capabilities and delivery model.
Risks
  • Past performance thresholds may require one additional teaming partner.
  • Potential clarification needed on staffing minimums before bid/no-bid.
Next steps

Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.

Quick Summary

Brookhaven National Laboratory (BNL), a U.S. Department of Energy contractor, is soliciting quotes for offsite Printed Circuit Board (PCB) Assembly Services. This opportunity is for a qualified vendor to provide labor-only assembly, with BNL supplying all PCBs and components. The effort includes a mandatory Phase 1 qualification build of 30 pre-production assemblies, followed by two optional production phases for 520 and 800 units respectively. Quotes are due by Friday, February 20, 2026, at 11:59 PM ET.

Scope of Work

The selected vendor will provide PCB assembly services for electronics operating at cryogenic temperatures (77 K) for DUNE FD-VD and FD-HD detectors. BNL will supply all PCBs and components, while the vendor is responsible for assembly, packaging, and shipping completed units, adhering to proposed lead times.

  • Phase 1 (Qualification): Assembly of 30 pre-production units, to be delivered within one month of contract award, accompanied by a certificate of quality compliance.
  • Phase 2 (Optional): Assembly of 520 production units for the Far Detector in Vertical Drift Technology (FD-VD).
  • Phase 3 (Optional): Assembly of 800 production units for the Far Detector in Horizontal Drift Technology (FD-HD), anticipated Fall 2026.
  • BNL will perform first article testing of the populated PCBs; this is not a supplier responsibility.

Key Requirements

Offerors must demonstrate:

  • Experience building cryogenic electronics assemblies of similar complexity (approx. 50 component types, SMT/through-hole mix, ~1,500 components).
  • Compliance with IPC-A-610 Class II and stringent ESD handling procedures.
  • A minimum of 20 years of experience in complex PCB assemblies.
  • References for at least 3 successfully fabricated jobs with comparable complexity, including evidence of use at cryogenic temperatures.

Contract & Timeline

  • Contract Type: Firm-Fixed Price (FFP)
  • Period of Performance: Effective upon execution through September 30, 2026, with 12 additional option months, potentially extending to September 30, 2027. Phase 1 delivery is one month after award.
  • Set-Aside: Full and Open Competition
  • NAICS Code: 334418 (Printed Circuit Assembly), Size Standard: 750 employees
  • Questions Due: Friday, February 13, 2026, 11:59 PM ET
  • Quote Due: Friday, February 20, 2026, 11:59 PM ET
  • Anticipated Freight Terms: FOB Destination, Freight Prepaid.

Submission & Evaluation

Quotes must be submitted via email and include the signed Quotation Pricing Sheet (Enclosure C) and SAM UEI Number. Award will be made to the responsive and responsible Offeror submitting the lowest total price that meets all technical requirements and RFQ qualifiers. Offerors must be registered in SAM.gov and complete AMS-Form-050 (Enclosure B) for representations and certifications.

Additional Notes

Required enclosures include a Draft Contract (A), Reps and Certs (B), Quotation Pricing Sheet (C), Vendor ACH Authorization (D), W-9 (E), and W-8 for foreign vendors (F). A Bill of Materials (BOM) is provided for component details.

People

Points of Contact

Blake ClemmerPRIMARY
Maile NicholsSECONDARY

Files

Files

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Versions

Version 3
Combined Synopsis/Solicitation
Posted: Feb 20, 2026
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Version 2Viewing
Combined Synopsis/Solicitation
Posted: Feb 17, 2026
Version 1
Combined Synopsis/Solicitation
Posted: Feb 5, 2026
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PCB (Printed Circuit Board) Assembly Service | GovScope