PCB (Printed Circuit Board) Assembly Service
Overview
Buyer
Place of Performance
NAICS
PSC
Set Aside
Original Source
Timeline
Qualification Details
Fit reasons
- NAICS alignment with historical contract wins in similar service areas.
- Scope strongly matches core technical capabilities and delivery model.
Risks
- Past performance thresholds may require one additional teaming partner.
- Potential clarification needed on staffing minimums before bid/no-bid.
Next steps
Validate eligibility requirements, assign capture owner, and schedule partner outreach to confirm teaming strategy before submission planning.
Quick Summary
Brookhaven National Laboratory (BNL), on behalf of the U.S. Department of Energy, seeks a qualified vendor for offsite Printed Circuit Board (PCB) assembly services on a labor-only basis. This full and open competition opportunity involves assembling PCBs and components supplied by BNL for electronics operating at cryogenic temperatures within DUNE FD-VD and FD-HD detectors. Quotes are due by March 9, 2026.
Scope of Work
The requirement is for PCB assembly services, with BNL providing all PCBs and components. The vendor will be responsible for packaging and shipping completed assemblies and meeting proposed lead times. The effort is structured in three phases:
- Phase 1 (Required Qualification): Assembly of 30 pre-production PCB units, to be delivered within one month of contract award, accompanied by a certificate of quality compliance. BNL will perform first article testing.
- Phase 2 (Optional Production): Assembly of 520 production units for the Far Detector in Vertical Drift Technology (FD-VD).
- Phase 3 (Optional Production): Assembly of 800 production units for the Far Detector in Horizontal Drift Technology (FD-HD), anticipated Fall 2026.
Key Requirements
Offerors must demonstrate:
- Experience in building complex cryogenic electronics assemblies (approx. 50 component types, mix of surface mount and through-hole, ~1,500 components).
- Compliance with IPC-A-610 Class II and stringent ESD handling procedures.
- A minimum of 20 years of experience in complex PCB assemblies.
- References for at least 3 successfully fabricated jobs of comparable complexity, including evidence of use at cryogenic temperatures.
- Component placement details (SMT and Thru Hole counts) are available in the provided Bill of Materials (BOM).
Contract Details
- Contract Type: Firm-Fixed Price (FFP).
- Anticipated Period of Performance: Contract award through September 30, 2026, with a 12-month option period exercisable in one-month increments, potentially extending to September 30, 2027.
- Freight Terms: FOB Destination, Freight Prepaid.
- Payment Terms: To Be Determined (TBD), upon receipt and approval of certified invoices and deliveries.
- NAICS Code: 334418 (Printed Circuit Assembly) with a 750-employee size standard.
- Incorporated Clauses: FAR 52.222-41 Service Contract Labor Standards and Wage Determination No. 2015-4157, Rev. 30.
Submission & Evaluation
- Submission Method: Email submissions only, including the signed Quotation Pricing Sheet (Enclosure C) and SAM UEI Number. Emails should be sent to the Contracts Specialist listed on page 1 of the RFQ with RFQ Number 471674 in the subject line.
- Required Forms: Enclosures A (Draft Contract), B (AMS-Form-050 Reps and Certs), C (Quotation Pricing Sheet), D (Vendor ACH Authorization), E (W-9), and F (W-8 for foreign vendors) are provided.
- Evaluation Criteria: Award will be made to the responsive and responsible Offeror submitting the lowest total price that meets all technical requirements and RFQ qualifiers.
- Eligibility: Offerors must be registered in the System for Award Management (SAM.gov).
Important Dates
- Questions Due Date: Friday, February 13, 2026, 11:59 PM ET.
- Quote Due Date & Time: Monday, March 9, 2026, 04:59 AM ET.
Contact Information
- Primary: Blake Clemmer (bclemmer@bnl.gov, 631-344-2762)
- Secondary: Maile Nichols (mnichols@bnl.gov, 631-344-3936)